技術能力
Item Standard Capable
| Panel Size Maximum | 460*610mm(18*24) | 544*620(21*24.4) |
| Layer Count | up to 12 | 26 |
| Lanminate Material | ||
| HIGH TG-FR4 | TG140 | TG200 |
| FPC | All kinds of Flexble.Pnint Cir | |
| MCPCB(metal core) | Aluminum Board;Copper Board | |
| Rogers(Low Dk/Df) | All series for RO 3000 AND RO 4000 | |
| Nelco | Nelco 4000;NELCO 7000 | |
| Isola | All series for ISOLA | |
| Halogen Free | TG150 | TG200 |
| Thickness | ||
| Finished Board Thickness | 0.2 mm-5.0 mm | 6.0 mm |
| Minimum Core Thickness | 0.075 mm | 0.05 mm |
| Finished Thickness Tolerance | 10% | 5% |
| Copper Foil Weights | ||
| Copper Foil Weights Intemal | 1/3 to 2 ounce | 5 ounce |
| Copper Foil Weights Extemal | 1/3 to 2 ounce | 5 ounce |
| Drilling | ||
| Minimum Drilled Hole Size | 0.2 mm | 0.15 mm |
| Finished Hoie Size(Normal) | 0.2 mm | 0.15 mm |
| HDI | 0.1 mm | 1 mm |
| Tolerances | ||
| Plated Hole Tolerances (+/-) | 0.076 mm(0.003'') | 0.05 mm(0.002'') |
| Non Plated Hole Tolerances (+/-) | 0.05 mm(0.002'') | |
| Dimension Tolerances (+/-) | 0.13 mm(0.005'') | 0.05 mm(0.002'') |
| Surface Finished | ||
| HASL/PB free | YES | |
| Plated Gold | YES | |
| OSP (Entek) | YES | |
| Immersion Tin | YES | |
| Carbon Ink | YES | |
| Selected immersion gold | YES | |
| Lines,Spaces & Pad Diameters | ||
| Inner Layer Line Width | 0.1 mm | 0.05 mm |
| Inner Layer Spacing | 0.1 mm | 0.076 mm |
| Outer Layer Line Width | 0.1 mm | 0.076 mm |
| Outer Layer Spacing | 0.1 mm | 0.076 mm |
| O/S Test Pitch | 0.4 mm | 0.35 mm |
| Registration | 0.076 mm(0.003'') | 0.05 mm(0.002'') |
| Solder mask | ||
| Minimum Mask Clearance (LPI) | 0.05 mm | 0.0025 mm |
| Soldermask Color | Green/Yellow/Black/Blue/Red | Any Color |
| Minimum Soldermask Dam | 0.076 mm | 0.05 mm |
| Legend | ||
| Legend Color | White | Yellow / Black |
| Warpage and Twist | 0.70% | |
| Special process | ||
| Board edge platin | YES | |
| Blind/ Buried Via | HDI (3+N+3) | any layer |
| Hole Aspect Ratio | 8 to 1 | 10 to 1 |
| Semi-routing hole | YES | |
| VIP | VIA filled with resin after plating | |