Panel Size Maximum | 460*610mm(18*24) | 544*620(21*24.4) |
Layer Count | up to 12 | 26 |
Lanminate Material | ||
HIGH TG-FR4 | TG140 | TG200 |
FPC | All kinds of Flexble.Pnint Cir | |
MCPCB(metal core) | Aluminum Board;Copper Board | |
Rogers(Low Dk/Df) | All series for RO 3000 AND RO 4000 | |
Nelco | Nelco 4000;NELCO 7000 | |
Isola | All series for ISOLA | |
Halogen Free | TG150 | TG200 |
Thickness | ||
Finished Board Thickness | 0.2 mm-5.0 mm | 6.0 mm |
Minimum Core Thickness | 0.075 mm | 0.05 mm |
Finished Thickness Tolerance | 10% | 5% |
Copper Foil Weights | ||
Copper Foil Weights Intemal | 1/3 to 2 ounce | 5 ounce |
Copper Foil Weights Extemal | 1/3 to 2 ounce | 5 ounce |
Drilling | ||
Minimum Drilled Hole Size | 0.2 mm | 0.15 mm |
Finished Hoie Size(Normal) | 0.2 mm | 0.15 mm |
HDI | 0.1 mm | 1 mm |
Tolerances | ||
Plated Hole Tolerances (+/-) | 0.076 mm(0.003'') | 0.05 mm(0.002'') |
Non Plated Hole Tolerances (+/-) | 0.05 mm(0.002'') | |
Dimension Tolerances (+/-) | 0.13 mm(0.005'') | 0.05 mm(0.002'') |
Surface Finished | ||
HASL/PB free | YES | |
Plated Gold | YES | |
OSP (Entek) | YES | |
Immersion Tin | YES | |
Carbon Ink | YES | |
Selected immersion gold | YES | |
Lines,Spaces & Pad Diameters | ||
Inner Layer Line Width | 0.1 mm | 0.05 mm |
Inner Layer Spacing | 0.1 mm | 0.076 mm |
Outer Layer Line Width | 0.1 mm | 0.076 mm |
Outer Layer Spacing | 0.1 mm | 0.076 mm |
O/S Test Pitch | 0.4 mm | 0.35 mm |
Registration | 0.076 mm(0.003'') | 0.05 mm(0.002'') |
Solder mask | ||
Minimum Mask Clearance (LPI) | 0.05 mm | 0.0025 mm |
Soldermask Color | Green/Yellow/Black/Blue/Red | Any Color |
Minimum Soldermask Dam | 0.076 mm | 0.05 mm |
Legend | ||
Legend Color | White | Yellow / Black |
Warpage and Twist | 0.70% | |
Special process | ||
Board edge platin | YES | |
Blind/ Buried Via | HDI (3+N+3) | any layer |
Hole Aspect Ratio | 8 to 1 | 10 to 1 |
Semi-routing hole | YES | |
VIP | VIA filled with resin after plating |